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P89C669 Datasheet(PDF) 18 Page - NXP Semiconductors |
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P89C669 Datasheet(HTML) 18 Page - NXP Semiconductors |
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18 / 33 page ![]() Philips Semiconductors P89C669 80C51 8-bit microcontroller family with extended memory Product data Rev. 02 — 13 November 2003 18 of 33 9397 750 12299 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9. Static characteristics [1] Typical ratings are not guaranteed. The values listed are at room temperature (+25 ˚C), 5 V, unless otherwise stated. [2] Capacitive loading on ports 0 and 2 may cause spurious noise to be superimposed on the VOL of ALE and ports 1, 3 and 4. The noise is due to external bus capacitance discharging into the Port 0 and Port 2 pins when these pins make 1-to-0 transitions during bus operations. In the worst cases (capacitive loading >100 pF), the noise pulse on the ALE pin may exceed 0.8 V. In such cases, it may be desirable to qualify ALE with a Schmitt Trigger, or use an address latch with a Schmitt Trigger STROBE input. IOL can exceed these conditions provided that no single output sinks more than 5 mA and no more than two outputs exceed the test conditions. [3] Capacitive loading on ports 0 and 2 may cause the VOH on ALE and PSEN to momentarily fall below the VDD − 0.7 V specification when the address bits are stabilizing. [4] Pins of ports 1, 2, 3 and 4 source a transition current when they are being externally driven from ‘1’ to ‘0’. The transition current reaches its maximum value when VIN is approximately 2 V for 4.5 V < VDD < 5.5 V. [5] See Figure 10 through Figure 13 for ICC test conditions. fosc is the oscillator frequency in MHz. [6] This value applies to Tamb =0 °C to +70 °C. [7] Load capacitance for port 0, ALE, and PSEN = 100 pF, load capacitance for all other outputs = 80 pF. [8] Under steady state (non-transient) conditions, IOL must be externally limited as follows: a) Maximum IOL per port pin: 15 mA b) Maximum IOL per 8-bit port: 26 mA Table 8: DC electrical characteristics Tamb =0 °Cto +70 °C for commercial, unless otherwise specified; VDD = 4.5 V to 5.5 V unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VIL LOW-level input voltage −0.5 - 0.2VDD − 0.1 V VIH HIGH-level input voltage (ports 0, 1, 2, 3, 4, EA) 0.2VDD + 0.9 - VDD + 0.5 V VIH1 HIGH-level input voltage, XTAL1, RST 0.7VDD -VDD + 0.5 V VOL LOW-level output voltage, ports 1, 2, 3, 4[8] VDD = 4.5 V; IOL = 1.6 mA - - 0.4 V VOL1 LOW-level output voltage, port 0, ALE, PSEN[7][8] VDD = 4.5 V; IOL = 3.2 mA - - 0.4 V VOH HIGH-level output voltage, ports 1, 2, 3, 4 VDD = 4.5 V; IOH = −30 A VDD − 0.7 - - V VOH1 HIGH-level output voltage (port 0 in external bus mode), ALE[9], PSEN[3] VDD = 4.5 V; IOH = −3.2 mA VDD − 0.7 - - V IIL Logical 0 input current, ports 1, 2, 3, 4 VIN = 0.4 V −1- −75 µA ITL Logical 1-to-0 transition current, ports 1, 2, 3, 4[8] 4.5 V < VDD < 5.5 V; VIN = 2.0 V [4] -- −650 µA IL1 Input leakage current, port 0 0.45 < VIN <VDD − 0.3 - - ±10 µA ICC Power supply current [5] -- - Active mode[5] VDD = 5.5 V - - 7 + 2.7 × fosc[MHz] mA Idle mode[5] - - 4 + 1.3 × fosc[MHz] mA Power-down mode or clock stopped (see Figure 13 for conditions) - 20 100 µA RRST Internal reset pull-down resistor 40 - 225 k Ω C10 Pin capacitance[10] (except EA) - - 15 pF |
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