MCP73830 datasheet(5/22 Pages) MICROCHIP

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DS20005049D-page 5

MCP73830/L

Thermal Shutdown

Die Temperature

TSD

—

150

—

C

Die Temperature

Hysteresis

TSDHYS

—10

—

C

AC CHARACTERISTICS

Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typical)+0.3V] to 6V,

TA = -40°C to +85°C. Typical values are at +25°C, VDD= [VREG(Typical)+1.0V]

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Elapsed Timer

Elapsed Timer Period

tELAPSED

3.5

4.0

4.5

Hours

Preconditioning Timer

Preconditioning Timer Period

tPRECHG

0.8

1.2

Hours

Status Indicator

Status Output Turn-Off

tOFF

——

500

µs

ISINK = 1 mA to 0 mA (Note 1)

Status Output Turn-On

tON

——

500

µs

ISINK = 0 mA to 1 mA (Note 1)

Note 1:

Not production tested. Ensured by design.

TEMPERATURE SPECIFICATIONS

Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typical) + 0.3V] to 6V.

Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Specified Temperature Range

-40

—

+85

°C

Operating Temperature Range

-40

—

+125

°C

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, TDFN-6 (2x2)



—

°C/W

4-Layer JC51-7 Standard

Board, Natural Convection



—19

—

°C/W

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V,

TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Note 1:

Not production tested. Ensured by design.

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