7

MDF51 Series

Part No.

HRS No.

Packaging

Finish

MDF51-24SCF(40)

547-2005-0 40

10,000 / reel

Tin plating

Please place orders in full reel increments.

2.25

3.1

1.4

t=0.2

1.8 to 2.6mm

Tools

●Applicable wire (Tin plated, annealed copper wire)

Unit : mm

Crimp contact

Usage Recommendations

Type

Part No.

HRS No.

Applicable contact

Applicator

AP105-MDF51-24S

901-4607-9 00

MDF51-24SCF

Press

CM-105

901-0005-4 00

-----------------

Contact extraction tool

DF-C-PO (B)

550-0179-2 00

MDF51-24SCF

1.Recommended temperature profile

Note 1 : Up to 2 cycles of Reflow soldering are possible under the same

conditions, provided that there is a return to normal temperature

between the first and second cycle.

Note 2 : The temperature profile indicates the board surface temperature at

the point of contact with the connector terminals.

2.Reccomended flow temperature

Peak temperature : 260ç for 10 seconds max.

3. Recommended manual soldering

Manual soldering : 350ç for 3 seconds max.

4. Recommended screen thickness

and open area ratio

(Pattern area ratio)

Thickness : 0.15mm

Open area ratio : 100%

5. Board warpage

Maximum of 0.03mm at the connector center, with both ends of the connector as

reference points.

6. Cleaning conditions

Refer to "Board to cable connectors Use Handbook".

7. Wire preparation and contact

crimping

Refer to “Board to cable connectors Use Handbook”.

The crimp contact termination must be performed using specified tools.

All dimensions and crimp conditions are listed in applicable Crimp Condition

Table and Crimping Quality Standards Manual.

Wire size (Stranded wire conductor)

Jacket diameter

AWG#24 (19 / Ø0.127mm)

Ø1.74mm

Note : When using other than the recommended wire, contact your nearest

Hirose sales representative.

10sMAX

30~60sec

60~120sec

255

180

ç

100

150

200

250

230

ç

Time (Seconds)

Temperature (ç)