ADGS1412

Data Sheet

Rev. 0 | Page 10 of 25

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

2

1

3

4

5

6

18

17

16

15

14

13

D4

S4

GND

S1

D1

D3

S3

NIC

S2

D2

ADGS1412

TOP VIEW

(Not to Scale)

NOTES

1. NIC = NOT INTERNALLY CONNECTED.

2. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR

INCREASED RELIABILITY OF THE SOLDER JOINTS AND

MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED

Figure 5. Pin Configuration

Table 9. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

D1

Drain Terminal 1. This pin can be an input or output.

2

S1

Source Terminal 1. This pin can be an input or output.

3

Most Negative Power Supply Potential. In single-supply applications, tie this pin to ground.

4, 11

GND

Ground (0 V) Reference.

5

S4

Source Terminal 4. This pin can be an input or output.

6

D4

Drain Terminal 4. This pin can be an input or output.

7, 8, 10, 12,

16, 19, 24

NIC

Not Internally Connected.

9

Pull the RESET pin low to complete a hardware reset. After a reset, all switches open, and the appropriate registers

are set to their default.

13

D3

Drain Terminal 3. This pin can be an input or output.

14

S3

Source Terminal 3. This pin can be an input or output.

15

Most Positive Power Supply Potential.

17

S2

Source Terminal 2. This pin can be an input or output.

18

D2

Drain Terminal 2. This pin can be an input or output.

20

SDO

Serial Data Output. This pin can be used for daisy chaining a number of these devices together or for reading

back the data stored in a register for diagnostic purposes. The serial data is propagated on the falling edge of

21

CS

Active Low Control Input. CS is the frame synchronization signal for the input data.

22

SCLK

Serial Clock Input. Data is captured on the positive edge of SCLK. Data can be transferred at rates of up to 50 MHz.

23

SDI

Serial Data Input. Data is captured on the positive edge of the serial clock input.

EPAD

Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and