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MS32 Datasheet(PDF) 2 Page - TE Connectivity Ltd

Part # MS32
Description  AMR Switching-Sensor
PDF  6 Pages
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Manufacturer  TEC [TE Connectivity Ltd]
Direct Link  http://www.te.com/usa-en/home.html
Logo TEC - TE Connectivity Ltd

MS32 Datasheet(HTML) 2 Page - TE Connectivity Ltd

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MS32
Switching Sensor
SENSOR SOLUTIONS /// MS32 Rev 6
1/2016
Page 2
CHARACTERISTIC VALUES
Parameter
Condition
Symbol
Min
Typ
Max
Unit
Mechanical dimensions
Length
X
2.5
mm
Width
Y
2.5
mm
Height
Z
0.75
mm
Pad size
7)
0.25 x 0.30
mm2
Operating limits
Max. supply voltage
VCC, MAX
30
V
Temp. compensation range
TCOMP
-25
+85
°C
Operating temperature
TOP
-45
+125
°C
Storage temperature
TST
-45
+150
°C
Stress above one or more of the limiting values may cause permanent damage to the device. Exposure to limiting values for extended periods
may affect device reliability.
Parameter
Condition
Symbol
Min
Typ
Max
Unit
Sensor specification (VCC = 5 V, T = 30 °C)
Supply voltage
VCC
5
30
V
Resistance
RB
10300
11500

Offset
VOFF/VCC
-4
-1.5
mV/V
Sensitivity
1)
S
2
3
(mV/V)/(kA/m)
Output amplitude
2)
VMAX
8
mV/V
Hysteresis (@ V0=0) 3)
Hyst.
0.9
mV/V
Sensor specification (T = -25 °C; +85°C; Conditions A & B) 6)
TC of amplitude
TCSV
-0.35
%/K
TC of bridge resistance
TCBR
+0.35
%/K
Switching field 5)
4)
Hs
1.40
1.85
2.30
kA/m
All parameters are measured on wafer level.
1) average gradient in the range 1.0 - 2.0 kA/m
2) difference between output voltage/supply voltage measured at H = 7 kA/m and H = 0 kA/m
3) hysteresis [in kA/m] = hysteresis [in mV/V] /S
4) switching voltage = 0 mV/V
5) switching field = magnetic field at switching voltage
6) values at
–25°C can be determined by linear extrapolation from +30°C- and +85°C-values.
7) recommended solder reflow process according to IPC/JEDEC J-STD-020D (Pb-Free Process)



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