TNETV2501INPGF datasheet(191/197 Pages) TI1

191 / 197 page

Mechanical Data

191

December 2002 − Revised November 2008

SPRS206K

Table 6−1. Thermal Resistance Characteristics (Ambient) (Continued)

PACKAGE

AIRFLOW (LFM)

BOARD TYPE†

RθJA (°C/W)

High-K

150

High-K

250

PGF

High-K

500

PGF

104

Low-K

150

Low-K

250

Low-K

500

† Board types are as defined by JEDEC. Reference JEDEC Standard JESD51−9, Test Boards for Area Array Surface Mount Package Thermal

Measurements.

‡ Adding thermal vias will significantly improve the thermal performance of the device. To use the thermal balls on the GZZ and ZZZ packages:

− An array of 25 land pads must be added on the top layer of the PCB where the package will be mounted.

− The PCB land pads should be the same diameter as the vias in the package substrate for optimal Board Level Reliability Temperature Cycle

performance.

− The land pads on the PCB should be connected together and to PCB through-holes. The PCB through-holes should in turn be connected

to the ground plane for heat dissipation.

− A solid internal plane is preferred for spreading the heat.

Refer to the MicroStar BGA

E Packaging Reference Guide (literature number SSYZ015) for guidance on PCB design, surface mount, and

reliability considerations.

Table 6−2. Thermal Resistance Characteristics (Case)

PACKAGE

RθJC (°C/W)

BOARD TYPE†

GZZ, ZZZ

2s JEDEC Test Card

PGF

13.2

2s JEDEC Test Card

† Board types are as defined by JEDEC. Reference JEDEC Standard JESD51−9, Test Boards for Area Array Surface

Mount Package Thermal Measurements.

TNETV2501INPGF Datasheet(PDF) 191 Page - Texas Instruments

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