STM32F303C6 datasheet(111/115 Pages) STMICROELECTRONICS

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STM32F303x6/x8

Package information

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7.5

Thermal characteristics

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

•

TA max is the maximum ambient temperature in ° C,

•ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max),

•

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

7.5.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org.

7.5.2

Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the ordering

information scheme shown in Table 76: Ordering information scheme.

Each temperature range suffix corresponds to a specific guaranteed ambient temperature at

maximum dissipation and, to a specific maximum junction temperature.

As applications do not commonly use the STM32F303x6/8 at maximum dissipation, it is

useful to calculate the exact power consumption and junction temperature to determine

which temperature range will be best suited to the application.

The following examples show how to calculate the temperature range needed for a given

application.

Example: high-performance application

Assuming the following application conditions:

Maximum ambient temperature TAmax = 82 °C (measured according to JESD51-2),

IDDmax = 50 mA, VDD = 3.5 V, maximum 20 I/Os used at the same time in output at low

Table 75. Package thermal characteristics

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

LQFP64 - 10 × 10 mm / 0.5 mm pitch

45°C/W

°C/W

ΘJA

Thermal resistance junction-ambient

LQFP32 - 7 × 7 mm / 0.8 mm pitch

60°C/W

°C/W

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