STM32L496QGI3STR datasheet(12/263 Pages) STMICROELECTRONICS

12 / 263 page

List of figures

STM32L496xx

12/263

DocID029173 Rev 2

Figure 48.

Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226

Figure 49.

Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 228

Figure 50.

Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229

Figure 51.

NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231

Figure 52.

NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231

Figure 53.

NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 231

Figure 54.

NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 232

Figure 55.

DCMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233

Figure 56.

SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234

Figure 57.

SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235

Figure 58.

UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid

array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237

Figure 59.

UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid

array recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238

Figure 60.

UFBGA169 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239

Figure 61.

UFBGA169, external SMPS device, marking (package top view) . . . . . . . . . . . . . . . . . . 240

Figure 62.

LQFP144 - 144-pin, 20 x 20 mm low-profile quad flat package outline . . . . . . . . . . . . . . 241

Figure 63.

LQFP144 - 144-pin,20 x 20 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243

Figure 64.

LQFP144 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244

Figure 65.

LQFP144, external SMPS device, marking (package top view) . . . . . . . . . . . . . . . . . . . . 244

Figure 66.

UFBGA132 - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245

Figure 67.

UFBGA132 - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246

Figure 68.

UFBGA132 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247

Figure 69.

LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat package outline . . . . . . . . . . . . . . 248

Figure 70.

LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249

Figure 71.

LQFP100 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250

Figure 72.

WLCSP100L – 4.618 x 4.142 mm, 0.4 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251

Figure 73.

WLCSP100L – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252

Figure 74.

WLCSP100L marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253

Figure 75.

WLCSP100, external SMPS device, marking (package top view) . . . . . . . . . . . . . . . . . . 254

Figure 76.

LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . 255

Figure 77.

LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256

Figure 78.

LQFP64 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257

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