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STM32L496QGI3STR Datasheet(PDF) 185 Page - STMicroelectronics |
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STM32L496QGI3STR Datasheet(HTML) 185 Page - STMicroelectronics |
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185 / 263 page  DocID029173 Rev 2 185/263 STM32L496xx Electrical characteristics 236 Figure 31. ADC accuracy characteristics Figure 32. Typical connection diagram using the ADC 1. Refer to Table 75: ADC characteristics for the values of RAIN and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (refer to Table 70: I/O static characteristics for the value of the pad capacitance). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. 3. Refer to Table 70: I/O static characteristics for the values of Ilkg. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 18: Power supply scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as close as possible to the chip. |
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