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AS8C803600 Datasheet(PDF) 1 Page - Alliance Semiconductor Corporation

Part # AS8C803600
Description  Power down controlled by ZZ input
PDF  18 Pages
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Manufacturer  ALSC [Alliance Semiconductor Corporation]
Direct Link  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS8C803600 Datasheet(HTML) 1 Page - Alliance Semiconductor Corporation

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September 2010
1
.
Features
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◆ 256K x 36, 512K x 18 memory configurations
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◆ Supports high system speed:
– 150MHz 3.8ns clock access time
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LBO input selects interleaved or linear burst mode
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◆ Self-timed write cycle with global write control (
GW), byte
write enable (
BWE), and byte writes (BWx)
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◆ 3.3V core power supply
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◆ Power down controlled by ZZ input
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◆ 3.3V I/O supply (VDDQ)
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◆ Packaged in a JEDEC Standard 100-pin thin plastic quad
flatpack (TQFP)
Description
The AS8C803600/801800 are high-speed SRAMs organized as
256K X 36, 512K X 18
3.3V
SynchronousSRAMs
3.3V I/O, Burst Counte
r
Pipelined Output
s,SingleCycleDeselect
AS8C803600
AS8C801800
256K x 36 / 512K x 18. The SRAMs contain write,
data,
address and control registers. Internal logic allows the SRAM to
generate a self-timed write based upon a decision which can be left
until the end of the write cycle.
The burst mode feature offers the highest level of performance to the
system designer, as the AS8C803600/801800 can provide four cycles of
dataforasingleaddresspresentedtotheSRAM. Aninternalburstaddress
counter accepts the first cycle address from the processor, initiating the
access sequence. The first cycle of output data will be pipelined for one
cycle before it is available on the next rising clock edge. If burst mode
operationisselected(
ADV=LOW),thesubsequentthreecyclesofoutput
data will be available to the user on the next three rising clock edges. The
order of these three addresses are defined by the internal burst counter
and the LBO input pin.
The AS8C803600/801800 SRAMs utilize the latest high-performance
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm100-
pin thin plastic quad flatpack (TQFP),
A0-A18
Address Inputs
Input
Synchronous
CE
Chip Enable
Input
Synchronous
CS0,
CS1
Chip Selects
Input
Synchronous
OE
Output Enable
Input
Asynchronous
GW
Global Write Enable
Input
Synchronous
BWE
Byte Write Enable
Input
Synchronous
BW1, BW2, BW3, BW4(1)
Individual Byte Write Selects
Input
Synchronous
CLK
Clock
Input
N/A
ADV
Burst Address Advance
Input
Synchronous
ADSC
Address Status (Cache Controller)
Input
Synchronous
ADSP
Address Status (Processor)
Input
Synchronous
LBO
Linear / Interleaved Burst Order
Input
DC
ZZ
Sleep Mode
Input
Asynchronous
I/O0-I/O31, I/OP1-I/OP4
Data Input / Output
I/O
Synchronous
VDD, VDDQ
Core Power, I/O Power
Supply
N/A
VSS
Ground
Supply
N/A
5310 tbl 01
Pin Description Summary
NOTE:
1.
BW3 and BW4 are not applicable for
other devices


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