ESDAULC6-1U2

Recommendation on PCB assembly

Doc ID 023270 Rev 1

7/10

4

Recommendation on PCB assembly

4.1

Stencil opening design

Figure 12.

Recommended stencil windows position (dimensions in mm)

4.2

Solder paste

1.

Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2.

“No clean” solder paste is recommended.

3.

Offers a high tack force to resist component movement during high speed

4.

Solder paste with fine particles: powder particle size is 20-45 µm.

0.425

0.20

0.038

0.065

Footprint

Stencil window

0.040

0.038

0.30

0.320

0.425

1.05

0.225