WM8224 datasheet(6/50 Pages) CIRRUS

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WM8224

Production Data

PD, Rev 4.2, September 2013

ABSOLUTE MAXIMUM RATINGS

Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at

or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical

Characteristics at the test conditions specified.

ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible

to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage

of this device.

Wolfson tests its package types according to IPC/JEDEC J-STD-020 for Moisture Sensitivity to determine acceptable storage

conditions prior to surface mount assembly. These levels are:

MSL1 = unlimited floor life at <30

C / 85% Relative Humidity. Not normally stored in moisture barrier bag.

MSL2 = out of bag storage for 1 year at <30

C / 60% Relative Humidity. Supplied in moisture barrier bag.

MSL3 = out of bag storage for 168 hours at <30

C / 60% Relative Humidity. Supplied in moisture barrier bag.

The Moisture Sensitivity Level for each package type is specified in Ordering Information.

CONDITION

MIN

MAX

Analogue supply voltage: AVDD

GND - 0.3V

GND + 5V

Digital supply voltage: DVDD

GND - 0.3V

GND + 5V

Digital ground: DGND

GND - 0.3V

GND + 0.3V

Analogue grounds: AGND1

 2

GND - 0.3V

GND + 0.3V

Analogue inputs (RINP, GINP, BINP)

GND - 0.3V

AVDD + 0.3V

Other Analogue pins

GND - 0.3V

AVDD + 0.3V

Digital I/O pins

GND – 0.3V

DVDD + 0.3V

Operating temperature range: TA

0C

+70C

Storage temperature prior to soldering

30C max / 85% RH max

Storage temperature after soldering

-65C

+150C

Notes:

GND denotes the voltage of any ground pin.

AGND1, AGND2 and DGND pins are intended to be operated at the same potential. Differential voltages

between these pins will degrade performance.

RECOMMENDED OPERATING CONDITIONS

CONDITION

SYMBOL

MIN

TYP

MAX

UNITS

Operating temperature range

C

Analogue supply voltage

AVDD

2.97

3.3

3.63

Digital core and I/O supply voltage

DVDD

2.97

3.3

3.63

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Performance

Thermal resistance – junction to

case

RθJC

Tambient = 25°C

10.27

°C/W

Thermal resistance – junction to

ambient

RθJA

29.45

°C/W

Notes:

Figure 3 Figures given are for package mounted on 4-layer FR4 according to JESD51-5 and JESD51-7.

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