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RT4730WSC Datasheet(PDF) 16 Page - Richtek Technology Corporation

Part # RT4730WSC
Description  Power Solution for Wearable AMOLED Products
PDF  17 Pages
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT4730WSC Datasheet(HTML) 16 Page - Richtek Technology Corporation

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RT4730
16
DS4730-01
March 2017
www.richtek.com
©
Copyright
2017 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
Layout Considerations
For the best performance of the RT4730, the following
PCB layout guidelines should be strictly followed.
For good regulation, place the power component as close
to the IC as possible. The traces should be wide and
short especially for the high current output loop.
The input and output bypass capacitor should be placed
as close the IC as possible and connected to the ground
plane of the PCB.
The flying capacitor should be placed as close to the
C1P/C1N pin as possible to avoid noise injection.
The inductor should be placed as close to LX1 and LX2
pin for reducing EMI.
Minimize the size of the LX1 and LX2 and keep the traces
wide and short. Care should be taken to avoid running
traces that carry any noise-sensitive signals near LX1
and LX2
Figure 2. PCB Layout Guide
LX1
PGND
C1N
2
SWIRE
AVDDEN
VON
VOUT
OVDD
AVDD
OVSS
AGND
CPGND
AVIN
PVIN
GND
LX
L1
C8
VBAT
C1
C6
GROUND
GROUND
SWIRE
AVDD
OVSS
C4
OVDD
C5
VON
GROUND
WL-CSP-16B 2.34x2.34 (BSC)
AVDDEN
C3
GROUND
C7
C9
P
1
C
The flying capacitor should be placed
as close to C1P/C1N pin as possible
to avoid noise injection.
The inductor should be
placed as close to LX1 and
LX2 pin for reducing EMI.
Minimize the size of the LX1 and LX2
and keep the traces wide and short.
Care should be taken to avoid running
traces that carry any noise-sensitive
signals near LX1 and LX2.
The output bypass capacitor should be placed
as close the IC as possible and connected to
the ground plane of the PCB.
Connect AGND、 PGND、CPGND in top layer.
The input bypass capacitor should be placed
as close the IC as possible and connected to
the ground plane of the PCB.



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