2003 Sep 26

10

Philips Semiconductors

Product specification

UHF push-pull power MOS transistor

BLF548

Fig.12 Component layout for 500 MHz class-B test circuit.

The circuit and components are situated on one side of the PTFE fibre-glass board, the other side being fully

metallized to serve as a ground plane. Connections are made by means of copper straps and hollow rivets for a

direct contact between upper and lower sheets.

handbook, full pagewidth

MBC231 - 1

R6

R2

C8

C7

L1/L2

L3

C1

C2

C3

C4

L4

L5

R4

R3

C5

C6

C9

L6

L7

C10

C11

VDS

VDS

C20

C21

C18

C19

L15

L9

L14

L19

L21

L20

C22

L18

C23

C24

L22/L23

L24

L12

L8

L13

C15

C17

C16

L17

R8

L16

L11

R7

L10

C13

C12

C14

handbook, full pagewidth

MBC230

200 mm

70

mm

strap

strap

strap

strap

strap

strap

strap

strap

rivets

rivets