AD9266-65EBZ datasheet(32/33 Pages) AD

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Data Sheet

AD9266

Rev. B | Page 31 of 32

APPLICATIONS INFORMATION

DESIGN GUIDELINES

Before starting design and layout of the AD9266 as a system,

it is recommended that the designer become familiar with these

guidelines, which discuss the special circuit connections and

layout requirements needed for certain pins.

Power and Ground Recommendations

When connecting power to the AD9266, it is strongly recom-

mended that two separate supplies be used. Use one 1.8 V supply

for analog (AVDD); use a separate 1.8 V to 3.3 V supply for the

digital output supply (DRVDD). If a common 1.8 V AVDD and

DRVDD supply must be used, the AVDD and DRVDD domains

must be isolated with a ferrite bead or filter choke and separate

decoupling capacitors. Several different decoupling capacitors

can be used to cover both high and low frequencies. Locate

these capacitors close to the point of entry at the PCB level

and close to the pins of the part, with minimal trace length.

A single PCB ground plane should be sufficient when using the

AD9266. With proper decoupling and smart partitioning of the

PCB analog, digital, and clock sections, optimum performance

is easily achieved.

Exposed Paddle Thermal Heat Sink Recommendations

The exposed paddle (Pin 0) is the only ground connection for

the AD9266; therefore, it must be connected to analog ground

(AGND) on the PCB. To achieve the best electrical and thermal

performance, mate an exposed (no solder mask) continuous

copper plane on the PCB to the AD9266 exposed paddle, Pin 0.

The copper plane should have several vias to achieve the

lowest possible resistive thermal path for heat dissipation to

flow through the bottom of the PCB. Fill or plug these vias

with nonconductive epoxy.

To maximize the coverage and adhesion between the ADC and

the PCB, overlay a silkscreen to partition the continuous plane on

the PCB into several uniform sections. This provides several tie

points between the ADC and the PCB during the reflow process.

Using one continuous plane with no partitions guarantees only one

tie point between the ADC and the PCB. For detailed information

about packaging and PCB layout of chip scale packages, see the

AN-772 Application Note, A Design and Manufacturing Guide

for the Lead Frame Chip Scale Package (LFCSP).

Encode Clock

For optimum dynamic performance, use a low jitter encode

clock source with a 50% duty cycle ± 5% to clock the AD9266.

VCM

The VCM pin should be decoupled to ground with a 0.1 μF

capacitor, as shown in Figure 38.

RBIAS

The AD9266 requires that a 10 kΩ resistor be placed between

the RBIAS pin and ground. This resistor sets the master current

reference of the ADC core and should have at least a 1% tolerance.

Reference Decoupling

Externally decouple the VREF pin to ground with a low ESR,

1.0 μF capacitor in parallel with a low ESR, 0.1 μF ceramic

capacitor.

SPI Port

The SPI port should not be active during periods when the full

dynamic performance of the converter is required. Because the

SCLK, CSB, and SDIO signals are typically asynchronous to the

ADC clock, noise from these signals can degrade converter

performance. If the on-board SPI bus is used for other devices,

it may be necessary to provide buffers between this bus and the

AD9266 to keep these signals from transitioning at the converter

inputs during critical sampling periods.

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