LED171596ARSLR datasheet(149/153 Pages) TI1

149 / 153 page

149

LED171596A

www.ti.com

SNVSAY2 – OCTOBER 2017

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10.3 Thermal Information

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the power

dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are:

•

Improving the power dissipation capability of the PCB design

•

Improving the thermal coupling of the component to the PCB by soldering the exposed thermal pad

•

Introducing airflow in the system

For more details on how to use the thermal parameters, see Thermal Characteristics of Linear and Logic

Packages Using JEDEC PCB Designs and Semiconductor and IC Package Thermal Metrics.

The LED171596A is designed for a maximum operating junction temperature (TJ) of 125°C. Therefore, the

maximum output power is limited by the power losses that can be dissipated over the actual thermal resistance,

given by the package and the surrounding PCB structures. Because the thermal resistance of the package is

fixed, increasing the size of the surrounding copper area and improving the thermal connection to the device can

reduce the thermal resistance. To get an improved thermal behavior, TI recommends using top-layer metal to

connect the device with wide and thick metal lines. Internal ground layers can connect to vias directly under the

device for improved thermal performance.

If short circuit or overload conditions are present, the device is protected by limiting internal power dissipation.

LED171596ARSLR Datasheet(PDF) 149 Page - Texas Instruments