AR0134CS datasheet(27/29 Pages) ONSEMI

Part #	AR0134CS

Description	1/3?릋nch 1.2 Mp CMOS Digital Image Sensor

PDF	29 Pages

Scroll/Zoom	100%

Manufacturer	ONSEMI [ON Semiconductor]

Direct Link	http://www.onsemi.com

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27 / 29 page

AR0134CS

www.onsemi.com

PACKAGE DIMENSIONS

IBGA63 9x9

CASE 503AG

ISSUE O

Notes:

1. Dimensions in mm.

Dimensions in () are for reference only.

2. Encapsulant: Epoxy.

3. Substrate material: Plastic laminate 0.25 thickness.

4. Lid material: Borosilicate glass 0.4

±0.04 thickness.

5. Refractive index at 20C = 1.5255 @ 546 nm and

1.5231 @ 588 nm.

6. Double side AR Coating: 530−570 nm R< 1%;

420−700 nm R < 2%.

7. Image sensor die: 0.2 mm thickness.

8. Solder ball material: SAC305 (95% Sn, 3% Ag,

0.5% Cu).

9. Dimensions apply to solder balls post reflow.

Pre-flow ball is 0.5 on a

∅0.4 SMD ball pad.

10. Maximum rotation of optical area relative to pack-

age edges: 1

°.

11. Maximum tilt of optical area relative to substrate

plane D: 25

mm.

12. Maximum tilt of cover glass relative to optical area

plane E: 50

mm.

AR0134CS Datasheet(PDF) 27 Page - ON Semiconductor