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S81B Marking, LM5007MM/NOPB Datasheet(PDF) 2 Page - Texas Instruments |
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LM5007MM/NOPB Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 32 page ![]() 2 LM5007 SNVS252H – SEPTEMBER 2003 – REVISED NOVEMBER 2018 www.ti.com Product Folder Links: LM5007 Submit Documentation Feedback Copyright © 2003–2018, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions ....................... 4 6.4 Thermal Information .................................................. 4 6.5 Electrical Characteristics........................................... 5 6.6 Typical Characteristics .............................................. 6 7 Detailed Description .............................................. 7 7.1 Overview ................................................................... 7 7.2 Functional Block Diagram ......................................... 7 7.3 Feature Description................................................... 8 7.4 Device Functional Modes........................................ 12 8 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application ................................................. 13 9 Power Supply Recommendations ...................... 17 10 Layout................................................................... 18 10.1 Layout Guidelines ................................................. 18 10.2 Layout Example .................................................... 18 11 Device and Documentation Support ................. 19 11.1 Device Support...................................................... 19 11.2 Documentation Support ........................................ 19 11.3 Community Resources.......................................... 20 11.4 Trademarks ........................................................... 20 11.5 Electrostatic Discharge Caution ............................ 20 11.6 Glossary ................................................................ 20 12 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (October 2015) to Revision H Page • Changed Features, editorial ................................................................................................................................................... 1 • Changed Typical Application Schematic, editorial.................................................................................................................. 1 • Changed Overcurrent Protection, editorial .......................................................................................................................... 10 • Changed Figure 7, editorial .................................................................................................................................................. 13 • Changed Power Supply Recommendations, editorial .......................................................................................................... 17 • Changed Layout Example to specify recommended component placement ....................................................................... 18 • Changed Device Support to include new content ................................................................................................................ 19 • Changed Documentation Support to include new content ................................................................................................... 19 Changes from Revision F (March 2013) to Revision G Page • Added Device Information table, ESD Ratings table, Thermal Information table, Application Information, Design Requirements, Application Curves, Power Supply Recommendations, Layout, and Community Resources. ..................... 1 • Added Typical Application Schematic ................................................................................................................................... 1 • Updated pinout drawing description ...................................................................................................................................... 3 Changes from Revision E (March 2013) to Revision F Page • Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 11 |
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