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S81B Marking, LM5007MM/NOPB Datasheet(PDF) 2 Page - Texas Instruments

Part # LM5007MM/NOPB
Description  LM5007 75-V, 0.5-A DC/DC Buck Converter With 80-V Integrated Power MOSFET
PDF  32 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

LM5007MM/NOPB Datasheet(HTML) 2 Page - Texas Instruments

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LM5007
SNVS252H – SEPTEMBER 2003 – REVISED NOVEMBER 2018
www.ti.com
Product Folder Links: LM5007
Submit Documentation Feedback
Copyright © 2003–2018, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 4
6.1
Absolute Maximum Ratings ...................................... 4
6.2
ESD Ratings.............................................................. 4
6.3
Recommended Operating Conditions ....................... 4
6.4
Thermal Information .................................................. 4
6.5
Electrical Characteristics........................................... 5
6.6
Typical Characteristics .............................................. 6
7
Detailed Description .............................................. 7
7.1
Overview ................................................................... 7
7.2
Functional Block Diagram ......................................... 7
7.3
Feature Description................................................... 8
7.4
Device Functional Modes........................................ 12
8
Application and Implementation ........................ 13
8.1
Application Information............................................ 13
8.2
Typical Application ................................................. 13
9
Power Supply Recommendations ...................... 17
10
Layout................................................................... 18
10.1
Layout Guidelines ................................................. 18
10.2
Layout Example .................................................... 18
11
Device and Documentation Support ................. 19
11.1
Device Support...................................................... 19
11.2
Documentation Support ........................................ 19
11.3
Community Resources.......................................... 20
11.4
Trademarks ........................................................... 20
11.5
Electrostatic Discharge Caution ............................ 20
11.6
Glossary ................................................................ 20
12
Mechanical, Packaging, and Orderable
Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (October 2015) to Revision H
Page
•
Changed Features, editorial ................................................................................................................................................... 1
•
Changed Typical Application Schematic, editorial.................................................................................................................. 1
•
Changed Overcurrent Protection, editorial .......................................................................................................................... 10
•
Changed Figure 7, editorial .................................................................................................................................................. 13
•
Changed Power Supply Recommendations, editorial .......................................................................................................... 17
•
Changed Layout Example to specify recommended component placement ....................................................................... 18
•
Changed Device Support to include new content ................................................................................................................ 19
•
Changed Documentation Support to include new content ................................................................................................... 19
Changes from Revision F (March 2013) to Revision G
Page
•
Added Device Information table, ESD Ratings table, Thermal Information table, Application Information, Design
Requirements, Application Curves, Power Supply Recommendations, Layout, and Community Resources. ..................... 1
•
Added Typical Application Schematic ................................................................................................................................... 1
•
Updated pinout drawing description ...................................................................................................................................... 3
Changes from Revision E (March 2013) to Revision F
Page
•
Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 11



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