S81B Marking, LM5007MMSLASHNOPB datasheet(3/32 Pages) TI2

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BST

RCL

RTN

RON

VCC

VIN

LM5007

www.ti.com

SNVS252H – SEPTEMBER 2003 – REVISED NOVEMBER 2018

Product Folder Links: LM5007

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5 Pin Configuration and Functions

DGK Package and NGT Package

8-Pin VSSOP and 8-Pin WSON

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Pin Functions

TYPE

DESCRIPTION

APPLICATION INFORMATION

NAME

Switching node.

Power switching node. Connect to the LC output filter.

BST

Boost bootstrap capacitor input.

An external capacitor is required between the BST and SW pins.

A 0.01-µF ceramic capacitor is recommended. An internal diode

between VCC and BST completes the buck gate drive bias

network.

RCL

Current Limit OFF-time programming pin

tOFF = 10

-5 / (0.59 + (V

FB / 7.22 × 10

− 6 × R

CL))

A resistor between this pin and RTN determines the variation of

off-time along with the FB pin voltage per cycle while in current

limit. The off-time is preset to 17 µs if FB = 0 V and decreases as

the FB voltage increases.

RTN

—

Circuit ground.

Feedback signal from regulated output.

This pin is connected to the inverting input of the internal

regulation comparator. The regulation threshold is 2.5 V.

RON

On-time set pin

tON = 1.42 × 10

-10 R

ON / VIN

A resistor between this pin and VIN sets the switch on-time as a

function of VIN. The minimum recommended on-time is 300 ns at

the maximum input voltage.

VCC

Output from the internal high-voltage bias

regulator. VCC is nominally regulated to 7 V.

If an auxiliary voltage is available to raise the voltage on this pin,

above the regulation set point (7V), the internal series pass

regulator will shutdown, reducing the IC power dissipation. Do not

exceed 14V. This output provides gate drive power for the internal

buck switch. An internal diode is provided between this pin and

the BST pin. A local 0.1-uF decoupling capacitor is

recommended. The series pass regulator is current limited to 10

mA.

VIN

Input supply voltage.

Recommended operating range: 9 V to 75 V.

—

Exposed PAD, underside of the WSON-8

package option.

Internally bonded to the die substrate. Connect to GND potential

for low thermal impedance.

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