© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN5353 • Rev. 1.0.3

3

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above

the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended

exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum

ratings are stress ratings only.

Symbol

Parameter

Min.

Max.

Unit

Voltage on SW, PVIN, VCC Pins

IC Not Switching

-0.3

7.0

V

IC Switching

-0.3

6.5

Voltage on Other Pins

-0.3

(3)

V

15

V/ms

Pull-Up Resistance from PGOOD to VCC

1

k

Ω

ESD

Electrostatic Discharge

Protection Level

Human Body Model per JESD22-A114

2

kV

Charged Device Model per JESD22-C101

2

Junction Temperature

–40

+150

°C

Storage Temperature

–65

+150

°C

Lead Soldering Temperature, 10 Seconds

+260

°C

Note:

3.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating

conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend

exceeding them or designing to Absolute Maximum Ratings.

Symbol

Parameter

Min.

Typ.

Max.

Unit

Supply Voltage Range

2.7

5.5

V

Output Voltage Range

0.8

90% Duty Cycle

V

Output Current

0

3

A

L

Inductor

0.47

µH

Input Capacitor

10

µF

Output Capacitor

20

µF

Operating Ambient Temperature

-40

+85

°C

Operating Junction Temperature

-40

+125

°C

Thermal Properties

Symbol

Parameter

Min.

Typ.

Max.

Unit

θ

JA

Junction-to-Ambient Thermal Resistance

(4)

46

°C/W

Note:

4.

Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer

1s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed junction