© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN5353 • Rev. 1.0.3

12

Physical Dimensions

Figure 24. 12-Lead, 3x3.5 mm Molded Leadless Package (MLP)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without

notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most

recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty

therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/dwg/ML/MLP12D.pdf.

1

3.50

3.00

A

B

PIN#1 IDENT

0.10 A

0.10 B

(0.2)

0.05

0.00

0.8 MAX

0.10 C

0.08 C

C

SIDE VIEW

TOP VIEW

BOTTOM VIEW

0.25+/-0.05 (12X)

0.50

1.60+/-0.05

2.60+/-0.05

(0.38)

0.45+/-0.05

0.10

C A B

0.05

C

2.60

2.84

1.05

1.85

2.65

0.85

0.85

LAND PATTERN RECOMMENDATION

2X

2X

0.25+/-0.05

PIN#1 IDENT

SEATING PLANE

NOTES:

A. CONFORMS TO JEDEC MO-229

VARIATION WFED-2.

B. DIMENSIONS ARE IN MILLIMETERS

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994

D. LANDPATTERN RECOMMENDATION IS

BASED ON IPC 7351 DESIGN GUIDELINES

E. LANDPATTERN EXTENSION TO INCLUDE

CENTER PAD TABS IS OPTIONAL

F. FILENAME AND REV: MKT-MLP12DREV1

(12X)

6

7

12