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MP8869W Datasheet(PDF) 3 Page - Monolithic Power Systems |
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MP8869W Datasheet(HTML) 3 Page - Monolithic Power Systems |
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3 / 41 page ![]() MP8869W – 3V - 18V, 12A, SYNCHRONOUS STEP-DOWN CONVERTER PRELIMINARY SPECIFICATIONS SUBJECT TO CHANGE MP8869W Rev. 1.02 www.MonolithicPower.com 3 1/18/2018 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2018 MPS. All Rights Reserved. PACKAGE REFERENCE 4 5 VOUT VIN VCC AGND BST A0 FB SS 6 SDA EN 13 12 11 1 SCL PG 14 10 9 3 7 SW PGND 2 8 TOP VIEW QFN-14 (3mmx4mm) ABSOLUTE MAXIMUM RATINGS (1) VIN.................................................. -0.3V to 19V VSW ............................... -0.6V (-7V for <10ns) to VIN + 0.7V (25V for <25ns) VBST .....................................................VSW + 4V VEN...............................................................18V VOUT ...............................................................7V All other pins.................................... -0.3V to 4V Continuous power dissipation (TA = +25°C) (2) QFN-14 (3mmx4mm) ................................ 2.5W Junction temperature ............................... 150°C Lead temperature .................................... 260°C Storage temperature .................. -65°C to 150°C Recommended Operating Conditions (3) Supply voltage (VIN) .......................... 3V to 18V Output voltage (VOUT)... 0.6V to 5.5V for FB loop and 0.6V to 1.55V for I2C loop Operating junction temp. (TJ) ... -40°C to +125°C Thermal Resistance (4) θJA θJC QFN-14 (3mmx4mm) ............. 48 ...... 11... °C/W NOTES: 1. Exceeding these ratings may damage the device. 2. The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3. The device is not guaranteed to function outside of its operating conditions. 4. Measured on JESD51-7, 4-layer PCB. |
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