AD8364ACPZ-R2 datasheet(41/44 Pages) AD

41 / 44 page

Data Sheet

AD8364

Rev. C | Page 41 of 44

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

Figure 85. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1,2

Temperature Range

Package Description

Package Option

Ordering Quantity

AD8364ACPZ-WP

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-7

36 Units

AD8364ACPZ-REEL7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-7

1,500 Units

AD8364ACPZ-R2

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-7

250 Units

AD8364-EVALZ

Evaluation Board

Z = RoHS Compliant Part.

WP = Waffle Pack.

AD8364ACPZ-R2 Datasheet(PDF) 41 Page - Analog Devices

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