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EMIF06-VID01C2 Datasheet(PDF) 4 Page - STMicroelectronics |
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EMIF06-VID01C2 Datasheet(HTML) 4 Page - STMicroelectronics |
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4 / 6 page ![]() EMIF06-VID01C1 4/6 Figure 8: Ordering Information Scheme Figure 9: FLIP-CHIP Package Mechanical Data Figure 10: Foot Print Recommendations Figure 11: Marking EMIF yy - xxx zz Cx EMI Filter Number of lines Information Package x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version C = Coated Flip-Chip x = 1: 500µm, Bump = 315µm = 2: Leadfree Pitch = 500µm, Bump = 315µm 2.92mm ± 50µm 315µm ± 50 500µm ± 50 250µm ± 50 690µm ± 65 Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 300µm copper pad diameter Dot, ST logo xx = marking yww = date code (y = year ww = week) z = packaging location 365 240 x y z w x w All dimensions in µm |
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