| Electronic Components Datasheet Search |
|
ADRF5027BCCZN-R7 Datasheet(PDF) 5 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
ADRF5027BCCZN-R7 Datasheet(HTML) 5 Page - Analog Devices |
|
5 / 13 page ![]() Data Sheet ADRF5027 Rev 0 | Page 5 of 13 ABSOLUTE MAXIMUM RATINGS For recommended operating conditions, see Table 1. Table 2. Parameter Rating Positive Supply Voltage −0.3 V to +3.6 V Negative Supply Voltage −3.6 V to +0.3 V Digital Control Input Voltage −0.3 V to VDD +0.3 V RF Input Power1 (200 kHz to 40 GHz at TCASE = 85°C2) Insertion Loss Path 26 dBm Isolation Path 25 dBm Hot Switching 25 dBm Temperature Junction, TJ 135°C Storage Range −65°C to +150°C Reflow 260°C Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) RFC, RF1, RF2 Pins 1500 V Digital Pins 2000 V Charged Device Model (CDM) 1250 V 1 For power derating vs. frequency, see Figure 2 and Figure 3. This power derating is applicable for insertion loss path, isolation path, and hot switching power specifications. 2 For 105°C operation, the power handling degrades from the TCASE = 85°C specification by 3 dB. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Only one absolute maximum rating can be applied at any one time. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction to case bottom (channel to package bottom) thermal resistance. Table 3. Thermal Resistance Package Type θJC Unit CC-20-3 Through Path 423 °C/W Terminated Path 241 °C/W POWER DERATING CURVES 2 –12 –10 –8 –6 –4 –2 0 10k 100k 1M 10M 100M 1G 10G 100G FREQUENCY (Hz) Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C 2 –12 –10 –8 –6 –4 –2 0 30 32 34 36 40 44 48 38 42 46 50 FREQUENCY (Hz) Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C ESD CAUTION |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |