Data Sheet

ADRF5027

Rev. 0 | Page 11 of 13

Figure 19. Evaluation Board Component Placement

Table 6. Evaluation Board Components

Component

Description

RF1_A, RFC_A, RF2_A

End launch connectors, 2.4 mm

VDD_A, VSS_A, CTRL_A, EN_A, GND_A

Through-hole mount test points

C7, C10

100 pF capacitors, 0402 package

R3, R4

0 Ω resistors, 0402 package

U2

ADRF5027 SPDT switch

PROBE MATRIX BOARD

The probe matrix board is a 4-layer board. This board also uses

an 8 mil Rogers RO4003 dielectric. The outer copper layers are

0.5 oz (0.7 mil) plated to 1.5 oz (2.2 mil). The RF transmission

lines were designed using a CPWG model with a width of

14 mil and a ground spacing of 7 mil to have a characteristic

impedance of 50 Ω.

1.5oz Cu (2.2mil)

1.5oz Cu (2.2mil)

0.5oz Cu (0.7mil)

0.5oz Cu (0.7mil)

1.5oz Cu (2.2mil)

RO4003

1.5oz Cu (2.2mil)

W = 14mil

G = 7mil

T = 2.2mil

H = 8mil

Figure 20. Probe Matrix Board Stack Up

Figure 20 and Figure 21 show the stack up and the layout,

respectively, of the probe matrix board. Measurements are made

using GSG probes at close proximity to the RF pins. Probing

reduces the reflections caused by mismatch arising from

connectors, cables, and board layout, resulting in a more

accurate measurement of insertion loss and return loss. Signal

coupling between the RF probes limits the isolation measurement.

The ADRF5027-EVALZ evaluation board is used for making

isolation measurements.

RF traces for a through-reflect-line (TRL) calibration are

designed on the probe matrix board. Board loss is compensated

for by using a nonzero line length at calibration. The actual

board duplicates the same layout in matrix form, which allows

multiple devices to assemble at once. Insertion loss and return

loss measurements are made on this board, while isolation

measurements are made on the ADRF5027-EVALZ evaluation

board.

RFC

VSS

EN

CTRL

VDD

RF2

EPAD

RF1

7mil

7mil

14mil

8mil

10mil

Figure 21. Probe Matrix Board Layout