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TLV9062IDDFR Datasheet(PDF) 30 Page - Texas Instruments |
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TLV9062IDDFR Datasheet(HTML) 30 Page - Texas Instruments |
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30 / 79 page ![]() OUT1 IN1 ± IN1 + V ± OUT2 IN2 ± IN2 + V+ VS± GND Ground (GND) plane on another layer Keep input traces short and run the input traces as far away from the supply lines as possible . Place components close to device and to each other to reduce parasitic errors . Use low-ESR, ceramic bypass capacitor . Place as close to the device as possible . VIN 1 GND RF RG VIN 2 GND RF RG VS+ GND OUT 1 OUT 2 Use low-ESR, ceramic bypass capacitor . Place as close to the device as possible . + VIN 2 VOUT 2 R G R F + VIN 1 VOUT 1 R G R F 30 TLV9061, TLV9062, TLV9064 SBOS839J – MARCH 2017 – REVISED SEPTEMBER 2019 www.ti.com Product Folder Links: TLV9061 TLV9062 TLV9064 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated 12.2 Layout Example Figure 41. Schematic Representation for Figure 42 Figure 42. Layout Example |
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