TLV9062IDDFR datasheet(13/79 Pages) TI1

13 / 79 page

TLV9061, TLV9062, TLV9064

www.ti.com

SBOS839J – MARCH 2017 – REVISED SEPTEMBER 2019

Product Folder Links: TLV9061 TLV9062 TLV9064

Submit Documentation Feedback

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

8.4 Thermal Information: TLV9061

THERMAL METRIC(1)

TLV9061

UNIT

DBV (SOT-23)

DCK (SC70)

DPW (X2SON)

5 PINS

RθJA

Junction-to-ambient thermal resistance

221.7

263.3

467

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

144.7

75.5

211.6

°C/W

RθJB

Junction-to-board thermal resistance

49.7

332.2

°C/W

ψJT

Junction-to-top characterization parameter

26.1

29.3

°C/W

ψJB

Junction-to-board characterization parameter

50.3

330.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

125

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics.

8.5 Thermal Information: TLV9061S

THERMAL METRIC(1)

TLV9061S

UNIT

DBV (SOT-23)

6 PINS

RθJA

Junction-to-ambient thermal resistance

216.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

155.1

°C/W

RθJB

Junction-to-board thermal resistance

96.2

°C/W

ψJT

Junction-to-top characterization parameter

80.3

°C/W

ψJB

Junction-to-board characterization parameter

95.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

8.6 Thermal Information: TLV9062

THERMAL METRIC(1)

TLV9062

UNIT

D (SOIC)

DGK (VSSOP)

DSG (WSON)

PW (TSSOP)

DDF (SOT-23)

8 PINS

RθJA

Junction-to-ambient thermal

resistance

157.6

201.2

94.4

205.8

184.4

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

104.6

85.7

116.5

106.7

112.8

°C/W

RθJB

Junction-to-board thermal

resistance

99.7

122.9

61.3

133.9

99.9

°C/W

ψJT

Junction-to-top

characterization parameter

55.6

21.2

34.4

18.7

°C/W

ψJB

Junction-to-board

characterization parameter

99.2

121.4

61.7

132.6

99.3

°C/W

RθJC(bot)

Junction-to-case (bottom)

thermal resistance

N/A

34.4

N/A

°C/W

TLV9062IDDFR Datasheet(PDF) 13 Page - Texas Instruments

TLV9062IDDFR Datasheet(HTML) 13 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79

Datasheet Download

Link URL