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AFSC5G35D35 Datasheet(PDF) 7 Page - NXP Semiconductors |
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AFSC5G35D35 Datasheet(HTML) 7 Page - NXP Semiconductors |
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7 / 12 page ![]() AFSC5G35D35 7 RF Device Data NXP Semiconductors Figure 3. PCB Pad Layout for 10 mm 6 mm Module 8.00 4.00 solder pad with heat dissipation structure. All dimensions in mm. 16 0.46 16 0.70 10 0.46 8 1.00 10 0.70 14 1.00 8.00 8.90 4.90 4.00 Figure 4. Product Marking AFSC5G35D35 ATWLYYWWZ |
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