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OPA2375IPWR Datasheet(PDF) 7 Page - Texas Instruments |
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OPA2375IPWR Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 51 page ![]() 7 OPA375, OPA2375 www.ti.com SBOS886B – NOVEMBER 2017 – REVISED JANUARY 2020 Product Folder Links: OPA375 OPA2375 Submit Documentation Feedback Copyright © 2017–2020, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953C. (2) This package option is preview for OPA2375. 7.5 Thermal Information for Dual Channel THERMAL METRIC (1) OPA2375, OPA2375S UNIT D (SOIC) DDF (2) (SOT-23-8) DGK (2) (VSSOP) DSG (2) (WSON) PW (2) (TSSOP) RUG (2) (X2QFN) 8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 131.1 153.8 TBD 78.2 185.6 140.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 73.2 80.2 TBD 97.5 74.5 52.6 °C/W RθJB Junction-to-board thermal resistance 74.5 73.1 TBD 44.6 116.3 69.7 °C/W ψJT Junction-to-top characterization parameter 24.4 6.6 TBD 4.7 12.6 1.0 °C/W ψJB Junction-to-board characterization parameter 73.3 72.7 TBD 44.6 114.6 67.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a TBD 19.8 n/a n/a °C/W |
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