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ESDX051-2BU3 Datasheet(PDF) 7 Page - STMicroelectronics

Part # ESDX051-2BU3
Description  2 lines ESD protection in bidirectional for high-speed differential interfaces
PDF  11 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ESDX051-2BU3 Datasheet(HTML) 7 Page - STMicroelectronics

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Recommendation on PCB assembly
3.1
Footprint
SMD footprint design is recommended.
Figure 13. Footprint in mm
150 µm
120 µm
450 µm
130 µm
130 µm
150 µm
Land pattern
3.2
Stencil opening design
Recommended design reference:
1.
Stencil opening thickness: 75 μm / 3 mils
2.
Stencil aperture ratio : 100 %
Figure 14. Recommended stencil window position in mm
Stencil opening for solder paste
200 µm
170 µm
450 µm
85 µm
85 µm
200 µm
3.3
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste is recommended.
3.
Offers a high tack force to resist component movement during high speed.
4.
Use solder paste with fine particles: powder particle size 20-38 µm.
ESDX051-2BU3
Recommendation on PCB assembly
DS13592 - Rev 1
page 7/11



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