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TMS320F28075PZPQ Datasheet(PDF) 39 Page - Texas Instruments |
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TMS320F28075PZPQ Datasheet(HTML) 39 Page - Texas Instruments |
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39 / 196 page  39 TMS320F28076, TMS320F28075 www.ti.com SPRS902I – OCTOBER 2014 – REVISED JUNE 2020 Submit Documentation Feedback Product Folder Links: TMS320F28076 TMS320F28075 Specifications Copyright © 2014–2020, Texas Instruments Incorporated 5.5 Power Consumption Summary Current values listed in this section are representative for the test conditions given and not the absolute maximum possible. The actual device currents in an application will vary with application code and pin configurations. Table 5-1 shows the device current consumption at 120-MHz SYSCLK. Table 5-2 shows the device current consumption at 120-MHz SYSCLK with the internal VREG enabled. (1) IDDIO current is dependent on the electrical loading on the I/O pins. (2) TYP: Vnom, 30°C (3) MAX: Vmax, 125°C (4) The following is executed in a loop on CPU1: • All of the communication peripherals are exercised in loop-back mode: CAN-A to CAN-B; SPI-A to SPI-C; SCI-A to SCI-D; I2C-A to I2C-B; McBSP-A to McBSP-B; USB • ePWM1 to ePWM12 generate 400-kHz PWM output on 24 pins • CPU TIMERs active • DMA does 32-bit burst transfers • CLA1 does multiply-accumulate tasks • All ADCs perform continuous conversion • All DACs ramp voltage up/down at 150 kHz • CMPSS1 to CMPSS8 active • TMU calculates a cosine • FPU does multiply/accumulate with parallel load (5) Brownout events during flash programming can corrupt flash data. Programming environments using alternate power sources (such as a USB programmer) must be capable of supplying the rated current for the device and other system components with sufficient margin to avoid supply brownout conditions. Table 5-1. Device Current Consumption at 120-MHz SYSCLK MODE TEST CONDITIONS IDD IDDIO (1) IDDA IDD3VFL TYP(2) MAX(3) TYP(2) MAX(3) TYP(2) MAX(3) TYP(2) MAX(3) Operational • Code is running out of RAM.(4) • All I/O pins are left unconnected. • Peripherals not active have their clocks disabled. • FLASH is read and in active state. • XCLKOUT is enabled at SYSCLK/4. 140 mA 295 mA 25 mA 13 mA 20 mA 33 mA 40 mA IDLE • CPU1 is in IDLE mode. • Flash is powered down. • XCLKOUT is turned off. 50 mA 185 mA 3 mA 10 mA 10 µA 150 µA 10 µA 150 µA STANDBY • CPU1 is in STANDBY mode. • Flash is powered down. • XCLKOUT is turned off. 25 mA 170 mA 3 mA 10 mA 5 µA 150 µA 10 µA 150 µA HALT • CPU1 watchdog is running. • Flash is powered down. • XCLKOUT is turned off. 1.5 mA 120 mA 750 µA 2 mA 5 µA 150 µA 10 µA 150 µA HIBERNATE • CPU1.M0 and CPU1.M1 RAMs are in low-power data retention mode. 300 µA 5 mA 750 µA 2 mA 5 µA 75 µA 1 µA 50 µA Flash Erase/Program(5) • CPU1 is running from RAM. • All I/O pins are left unconnected. • Peripheral clocks are disabled. • CPU1 is performing Flash Erase and Programming. • XCLKOUT is turned off. 97 mA 145 mA 3 mA 10 mA 10 µA 150 µA 45 mA 55 mA |
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