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TMS320F28075PZP Datasheet(PDF) 8 Page - Texas Instruments

Part # TMS320F28075PZP
Description  TMS320F2807x Microcontrollers
PDF  192 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TMS320F28075PZP Datasheet(HTML) 8 Page - Texas Instruments

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GPIO70
GPIO71
GPIO72
GPIO73
GPIO78
GPIO84
GPIO85
GPIO86
GPIO87
GPIO2
GPIO3
GPIO4
GPIO89
GPIO90
GPIO91
GPIO92
GPIO10
V
DD
V
DD
V
DD
V
DDIO
V
DDIO
V
DDIO
V
DDIO
V
DD
TCK
TDO
TDI
FLT1
FLT2
ADCINB5
ADCINB4
ADCINB3
ADCINB2
ADCINB1
ADCINB0
ADCIN15
ADCIN14
V
DD
V
DD
V
SSA
V
DD3VFL
V
DDIO
V
DDA
V
REFHIB
V
SSA
V
REFLOB
V
DDIO
TMS
TRST
A. Only the GPIO function is shown on GPIO pins. See Section 6.2.1 for the complete, muxed signal name.
Figure 6-2. 100-Pin PZP PowerPAD HTQFP (Top View)
Note
The exposed lead frame die pad of the PowerPAD™ package serves two functions: to remove heat
from the die and to provide ground path for the digital ground (analog ground is provided through
dedicated pins). Thus, the PowerPAD should be soldered to the ground (GND) plane of the PCB
because this will provide both the digital ground path and good thermal conduction path. To make
optimum use of the thermal efficiencies designed into the PowerPAD package, the PCB must be
designed with this technology in mind. A thermal land is required on the surface of the PCB directly
underneath the body of the PowerPAD. The thermal land should be soldered to the exposed lead
frame die pad of the PowerPAD package; the thermal land should be as large as needed to dissipate
the required heat. An array of thermal vias should be used to connect the thermal pad to the internal
GND plane of the board. See PowerPAD™ Thermally Enhanced Package for more details on using
the PowerPAD package.
TMS320F28076, TMS320F28075
SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
www.ti.com
8
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Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: TMS320F28076 TMS320F28075



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