VSC8201DL

Rev. 1.6.3 - 9/29/04

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- Page 19 of 21 -

Thermal Performance

Figure 12: Heat dissipating path for IC packages

The two paths of heat dissipation shown in the above figure are as follows:

1. IC chip

2. IC chip

The amount of heat dissipated by path 2. depends on various factors like pad size, wired length, layer configuration, thickness, materials

etc. of the PC board but, typically, 10% to 50% of the heat is dissipated through the PC board.

Although low power consumption of the VSC8201 eliminates the need of external heatsinks or fans in most designs, it is always recom-

mended to follow certain guidelines for adequate heat dissipation.

For proper operation of the VSC8201, a silicon junction temperature

temperature ranges. Within the constraints of the commercial temperature range, the limits for junction-to-ambient thermal resistance are

where

= Junction to ambient thermal resistance,

= Junction temperature,

Table 8: Recommended Magnetic Modules

Part Number

Manufacturer

Description

Return Loss

Compensation

LF9207A

Delta

Single-port, surface mount

H5008

Pulse

Single-port, surface mount

S558-5999-P3

Bel

Single-port, surface mount

TG1G-S002NZ

Halo

Single-port, surface mount

GB2G04

Transpower

Single-port, surface mount

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