List of figures

Figure 1.

Block diagram .................................................................... 2

Figure 2.

Pin connection (top view) ............................................................. 3

Figure 3.

Typical application diagram (external controller used for CLREF pin)................................ 5

Figure 4.

Typical application diagram (current limit fixed via RCL) ........................................ 6

Figure 5.

Typical application diagram (multiple e-fuses in parallel)........................................ 7

Figure 6.

Current monitor simplified circuit ....................................................... 16

Figure 7.

Additional connections for multiple STEF12H60MAPUR (autoretry version) ......................... 19

Figure 8.

Quiescent current vs. temperature...................................................... 20

Figure 9.

Shutdown current vs. temperature...................................................... 20

Figure 10.

IMON gain accuracy vs. load current and temperature ........................................ 20

Figure 11.

IMON current vs. load current ......................................................... 20

Figure 12.

CS current vs. temperature .......................................................... 21

Figure 13.

VCLREF threshold vs. temperature ...................................................... 21

Figure 14.

CLREF pin bias current vs. temperature.................................................. 21

Figure 15.

VDD voltage vs. temperature.......................................................... 21

Figure 16.

VTEMP voltage vs. temperature ........................................................ 21

Figure 17.

UVLO thresholds vs. temperature ...................................................... 21

Figure 18.

ON/PD thresholds vs. temperature ..................................................... 22

Figure 19.

ON/PD pin current vs. temperature ..................................................... 22

Figure 20.

SS pin bias current vs. temperature..................................................... 22

Figure 21.

Turn-on initial delay vs. temperature .................................................... 22

Figure 22.

On-resistance vs. temperature ........................................................ 22

Figure 23.

Off-state leakage current vs. temperature................................................. 22

Figure 24.

Startup by VIN (no load) ............................................................. 23

Figure 25.

Shutdown by VIN (no load) ........................................................... 23

Figure 26.

Startup by VIN (COUT = 6200 µF, no load)................................................. 23

Figure 27.

Startup by VIN (COUT = 6200 µF, 15 A, res. load)............................................ 23

Figure 28.

Startup by ON/PD (no load) .......................................................... 23

Figure 29.

Shutdown by ON/PD (no load) ........................................................ 23

Figure 30.

Startup by ON/PD (IOUT = 15 A, COUT = 6800 µF) ........................................... 24

Figure 31.

Shutdown by ON/PD (IOUT = 15 A, COUT = 6800 µF) ......................................... 24

Figure 32.

Startup into output short-circuit ........................................................ 24

Figure 33.

Output short-circuit during operation .................................................... 24

Figure 34.

QFN 32 (5 x 5) package outline ....................................................... 25

Figure 35.

QFN 32 (5 x 5) recommended footprint .................................................. 26

Figure 36.

QFN 32 (5 x 5) carrier tape........................................................... 27

Figure 37.

Pin 1 orientation in tape ............................................................. 27

Figure 38.

QFN 32 (5 x 5) reel outline ........................................................... 28

STEF12H60M

List of figures

DS13608 - Rev 3

page 33/34