HMC774ALC3BTR-R5 datasheet(25/27 Pages) AD

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Data Sheet

HMC774ALC3B

Rev. A | Page 25 of 27

APPLICATIONS INFORMATION

EVALUATION BOARD

Figure 93 and Figure 94 show the top and cross sectional views

of the evaluation board, which uses 4-layer construction, with a

copper thickness of 0.5 oz (0.7 mil) and dielectric materials

between each copper layer.

Figure 93. Evaluation Board Layout Top View

0.5oz Cu (0.7mil)

W = 18mil

G = 13mil

0.5oz Cu (0.7mil)

10mil ARLON 25 FR or ROGERS 4350

ISOLA 370HR AS REQUIRED

PREPREG AS REQUIRED

0.5oz Cu (0.7mil)

Figure 94. Evaluation Board Cross Sectional View

All RF traces are routed on Layer 1, and all other remaining

layers are ground planes that provide a solid ground for RF

transmission lines. The top dielectric material is Rogers 4350,

offering low loss performance. The prepreg material in the

middle sticks core layers together, which includes an Isola

370HR layer with copper traces above and below. Both the

prepreg material and the Isola 370HR core layer are used to

achieve required board finish thickness.

The RF transmission lines are designed using a coplanar

waveguide (CPWG) model with a width of 18 mil and ground

spacing of 13 mil for a characteristic impedance of 50 Ω. For

optimal RF and thermal grounding, as many plated through

vias as possible are arranged around the transmission lines and

under the exposed pad of the package.

Figure 95 shows the actual EV1HMC774ALC3B evaluation board

with component placement. Because the EV1HMC774ALC3B is a

passive device, there is no requirement for external components.

The LO, RF, and IF pins are internally dc-coupled. Use an

external series capacitor when an operation is not required.

Choose a value that stays within the necessary frequency range

for each port. When an operation to dc is required, do not

exceed the source and sink current ratings specified in the

Absolute Maximum Ratings section.

1000mils

590mils

Figure 95. EV1HMC774ALC3B Evaluation Board

The EV1HMC774ALC3B evaluation board shown in Figure 95

is available for order from the Analog Devices, Inc., website at

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