HMC774ALC3BTR-R5 datasheet(4/27 Pages) AD

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HMC774ALC3B

Data Sheet

Rev. A | Page 4 of 27

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

RF Input Power when LO = 18 dBm

21 dBm

LO Drive

25 dBm

IF Input Power when LO = 18 dBm

21 dBm

LO and RF DC Source and Sink Current

55 mA

IF Port Maximum Sink and Source Current

3 mA

Maximum Channel Temperature

175°C

Maximum Junction Temperature

165°C

Continuous Power Dissipation, PDISS

(TA = 85°C, Derate 2.9 mW/°C Above 85°C)

189 mW

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature Range

−65°C to +150°C

Reflow Temperature

260°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

Class 1C (1.5 kV)

Field Induced Charge Device Model (FICDM)

Class IV (1.25 kV)

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the thermal resistance value that is measured from

junction to air, and θJC is the thermal resistance value that is

measured from junction to case (package).

Table 4. Thermal Resistance

Package Type1

θJA

θJC

Unit

E-12-4

120

274

°C/W

See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance (PCB with 3 × 3 vias).

ESD CAUTION

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