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HMC774ALC3BTR-R5 Datasheet(PDF) 27 Page - Analog Devices |
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HMC774ALC3BTR-R5 Datasheet(HTML) 27 Page - Analog Devices |
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27 / 27 page ![]() Data Sheet HMC774ALC3B Rev. A | Page 27 of 27 OUTLINE DIMENSIONS 0.50 BSC 0.32 BSC BOTTOM VIEW TOP VIEW SIDE VIEW 0.08 BSC 1 4 6 7 9 10 12 3 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.36 0.30 0.24 PIN 1 EXPOSED PAD PIN 1 INDICATOR 3.05 2.90 SQ 2.75 2.10 BSC 1.00 REF 1.60 1.50 SQ 1.40 0.90 0.80 0.70 SEATING PLANE Figure 98. 12-Terminal Ceramic Leadless Chip Carrier [LCC] (E-12-4) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Moisture Sensitivity Level (MSL) Rating2 Package Description Package Option HMC774ALC3B −40°C to +85°C MSL3 12-Terminal Ceramic Leadless Chip Carrier [LCC] E-12-4 HMC774ALC3BTR −40°C to +85°C MSL3 12-Terminal Ceramic Leadless Chip Carrier [LCC] E-12-4 HMC774ALC3BTR-R5 −40°C to +85°C MSL3 12-Terminal Ceramic Leadless Chip Carrier [LCC] E-12-4 EV1HMC774ALC3B Evaluation PCB Assembly 1 All models are RoHS Compliant Parts. 2 See Figure 96 for the peak reflow temperature. ©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13897-0-6/18(A) |
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