6.4 Thermal Information (continued)

THERMAL METRIC(1)

TMUX646

UNIT

ZEC (nFBGA)

36 PINS

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

POWER SUPPLY

VDD active supply current

OE = 0 V

SEL = 0 V or 5.5 V

Dn, CLKn = 0 V

30

55

µA

Power-down supply current

SEL = 0 V or 5.5 V

Dn, CLKn = 0 V

0.1

1

µA

Increase in supply current per

logic pin at 1.8 V

OE = 1.8 V

Dn, CLKn = 0 V

1.3

µA

OE = 1.8 V

Dn, CLKn = 0 V

2.5

µA

DC CHARACTERISTICS

On-state resistance

Dn, CLKn = –8 mA, 0.2 V

DAn, DBn, CLKAn, CLKBn = 0.2 V, –8 mA

6

9

Ω

On-state resistance

Dn, CLKn = –8 mA, 1.2 V

DAn, DBn, CLKAn, CLKBn = 1.2 V, –8 mA

6

10

Ω

On-state resistance flatness

Dn, CLKn = –8 mA, 0 V to 0.3 V

DAn, DBn, CLKAn, CLKBn = 0 V to 0.3 V, –8

mA

0.1

Ω

On-state resistance flatness

Dn, CLKn = –8 mA, 0 V to 1.3 V

DAn, DBn, CLKAn, CLKBn = 0 V to 1.3 V, –8

mA

0.9

Ω

On-state resistance match

between + and – paths

Dn, CLKn = –8 mA, 0.2 V

DAn, DBn, CLKAn, CLKBn = 0.2 V, –8 mA

0.1

Ω

On-state resistance match

between + and – paths

Dn, CLKn = –8 mA, 1.3 V

DAn, DBn, CLKAn, CLKBn = 1.3 V, –8 mA

0.1

Ω

TMUX646

SCDS432 – JUNE 2021

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