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EXAMPLE BOARD LAYOUT

0.05 MIN

0.05 MAX

6X (

0.2)

(0.4) TYP

(0.4) TYP

(

0.2)

SOLDER MASK

OPENING

(

0.2)

METAL

4226594/A 03/2021

DSBGA - 0.4 mm max height

YBH0006-C02

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).

SOLDER MASK DETAILS

NOT TO SCALE

SYMM

SYMM

1

2

A

B

EXPOSED METAL SHOWN

LAND PATTERN EXAMPLE

SCALE: 50X

C

NON-SOLDER MASK

DEFINED

EXPOSED

METAL

SOLDER MASK

OPENING

SOLDER MASK

DEFINED

(PREFERRED)

METAL UNDER

SOLDER MASK

EXPOSED

METAL

TPS22950

SLVSFJ2 – DECEMBER 2020

www.ti.com

20

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