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STM32F732IE Datasheet(PDF) 199 Page - STMicroelectronics |
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STM32F732IE Datasheet(HTML) 199 Page - STMicroelectronics |
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199 / 226 page  DS11854 Rev 6 199/226 STM32F732xx STM32F733xx Package information 222 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 LQFP64 – 10 x 10 mm, low-profile quad flat package information LQFP64 is a 64-pin, 10 x 10 mm low-profile quad flat package. Figure 78. LQFP64 outline 1. Drawing is not to scale. 5W_ME_V3 SEATING PLANE ccc C b C L L1 K IDENTIFICATION PIN 1 D D1 D3 e 1 16 17 32 33 48 49 64 GAUGE PLANE 0.25 mm Table 115. LQFP64 mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A - - 1.60 - - 0.0630 A1 0.05 - 0.15 0.0020 - 0.0059 A2 1.350 1.40 1.45 0.0531 0.0551 0.0571 |
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