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STM32F732IE Datasheet(PDF) 26 Page - STMicroelectronics

Part # STM32F732IE
Description  Arm® Cortex®-M7 32b MCUFPU, 462DMIPS, up to 512KB Flash 256164KB RAM, USB OTG HS/FS, 18 TIMs, 3 ADCs, 21 com IF
PDF  226 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F732IE Datasheet(HTML) 26 Page - STMicroelectronics

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Functional overview
STM32F732xx STM32F733xx
26/226
DS11854 Rev 6
3.12
Clocks and startup
On reset the 16 MHz internal HSI RC oscillator is selected as the default CPU clock.
The 16 MHz internal RC oscillator is factory-trimmed to offer 1% accuracy. The application
can then select as system clock either the RC oscillator or an external 4-26 MHz clock
source. This clock can be monitored for failure. If a failure is detected, the system
automatically switches back to the internal RC oscillator and a software interrupt is
generated (if enabled). This clock source is input to a PLL thus allowing to increase the
frequency up to 216 MHz. Similarly, a full interrupt management of the PLL clock entry is
available when necessary (for example if an indirectly used external oscillator fails).
Several prescalers allow the configuration of the two AHB buses, the high-speed APB
(APB2), and the low-speed APB (APB1) domains. The maximum frequency of the two AHB
buses is 216 MHz, while the maximum frequency of the high-speed APB domains is
108 MHz. The maximum allowed frequency of the low-speed APB domain is 54 MHz.
The devices embed two dedicated PLLs (PLLI2S and PLLSAI) which allow audio class
performance to be achieved. In this case, the I2S and SAI master clock can generate all
standard sampling frequencies from 8 kHz to 192 kHz.
The STM32F733xx devices embed two PLLs inside the PHY HS controller: PLL1 and PLL2.
The PLL1 allows an output of 60 MHz used as an input for PLL2 which itself allows the
generation of 480 Mbps in the USB OTG High Speed mode.
The PLL1 has as input HSE clock.
3.13
Boot modes
At startup, the boot memory space is selected by the BOOT pin and BOOT_ADDx option
bytes, allowing any boot memory address to be programmed from 0x0000 0000 to
0x3FFF FFFF, which includes:
•
all Flash address space mapped on ITCM or AXIM interface
•
all RAM address space: ITCM, DTCM RAMs, and SRAMs mapped on AXIM interface
•
system memory bootloader
The bootloader is located in system memory. It is used to reprogram the Flash memory
through a serial interface.
3.14
Power supply schemes
•
VDD = 1.7 to 3.6 V: external power supply for I/Os and the internal regulator (when
enabled), provided externally through VDD pins.
•
VSSA, VDDA = 1.7 to 3.6 V: external analog power supplies for ADC, DAC, reset blocks,
RCs and PLL. VDDA and VSSA must be connected to VDD and VSS, respectively.
•
VBAT = 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and
backup registers (through power switch) when VDD is not present.
Note:
The VDD/VDDA minimum value of 1.7 V is obtained when the internal reset is OFF (refer to
Section 3.15.2: Internal reset OFF). Refer to Table 3: Voltage regulator configuration mode
versus device operating mode to identify the packages supporting this option.
•
The VDDSDMMC can be connected either to VDD or to an external independent power
supply (1.8 to 3.6 V) for the SDMMC2 pins (clock, command, and 4-bit data).



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