STM32L071KB datasheet(61/148 Pages) STMICROELECTRONICS

61 / 148 page

DS10690 Rev 7

61/148

STM32L071xx

Electrical characteristics

112

Power dissipation at TA = 85 °C

(range 6) or TA =105 °C (rage 7) (3)

UFBGA100 package

351

LQFP100 package

488

UFBGA64 package

308

TFBGA64 package

313

LQFP64 package

435

WLCSP49 package

417

LQFP48 package

370

UFQFPN48 package

714

UFQFPN32 package

556

LQFP32 package

333

Power dissipation at TA = 125 °C

(range 3) (3)

UFBGA100 package

LQFP100 package

122

UFBGA64 package

TFBGA64 package

LQFP64 package

109

WLCSP49 package

104

LQFP48 package

UFQFPN48 package

179

UFQFPN32 package

139

LQFP32 package

Temperature range

Maximum power dissipation (range 6)

–40

°C

Maximum power dissipation (range 7)

–40

105

Maximum power dissipation (range 3)

–40

125

Junction temperature range (range 6) -40 °C

≤TA ≤85 °

–40

105

Junction temperature range (range 7) -40 °C

≤TA ≤105 °C

–40

125

Junction temperature range (range 3) -40 °C

≤TA ≤125 °C

–40

130

1. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and VDDA

can be tolerated during power-up and normal operation.

2. To sustain a voltage higher than VDD+0.3V, the internal pull-up/pull-down resistors must be disabled.

3. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJ max (see Table 24: Thermal characteristics on

page 59).

Table 25. General operating conditions (continued)

Symbol

Parameter

Conditions

Min

Max

Unit

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