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STM32L071KB Datasheet(PDF) 9 Page - STMicroelectronics

Part # STM32L071KB
Description  Access line ultra-low-power 32-bit MCU Arm®-based Cortex®-M0, up to 192KB Flash, 20KB SRAM, 6KB EEPROM, ADC
PDF  148 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L071KB Datasheet(HTML) 9 Page - STMicroelectronics

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STM32L071xx
List of figures
9
grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Figure 43.
UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball
grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Figure 44.
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . 118
Figure 45.
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat recommended footprint . . . . . . . . . . 119
Figure 46.
LQFP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Figure 47.
UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch
ball grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Figure 48.
UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch
ball grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Figure 49.
TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch thin profile fine pitch ball
grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Figure 50.
TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball
,grid array recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Figure 51.
TFBGA64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Figure 52.
WLCSP49 - 49-pin, 3.294 x 3.258 mm, 0.4 mm pitch wafer level chip scale
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Figure 53.
WLCSP49 - 49-pin, 3.294 x 3.258 mm, 0.4 mm pitch wafer level chip scale
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Figure 54.
WLCSP49 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Figure 55.
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 129
Figure 56.
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat recommended footprint . . . . . . . . . . . . 130
Figure 57.
LQFP48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Figure 58.
UFQFPN48 - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Figure 59.
UFQFPN48 - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Figure 60.
UFQFPN48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
Figure 61.
LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 135
Figure 62.
LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat recommended footprint . . . . . . . . . . . . 136
Figure 63.
LQFP32 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Figure 64.
UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Figure 65.
UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
Figure 66.
UFQFPN32 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Figure 67.
Thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142



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