STM32WB55 datasheet(170/193 Pages) STMICROELECTRONICS

Part #	STM32WB55

Description	Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.2 and 802.15.4 radio solution

PDF	193 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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170 / 193 page

Package information

STM32WB55xx STM32WB35xx

170/193

DS11929 Rev 11

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

7.1

UFBGA129 package information

This UFBGA is a 129-ball, 7 x 7 mm, 0.5 mm fine pitch, square ball grid array package.

Figure 38. UFBGA129 package outline

1. Drawing is not to scale.

2. - The terminal A1 corner must be identified on the top surface by using a corner chamfer,



ink or metalized markings, or other feature of package body or integral heat slug.



- A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1



corner. Exact shape of each corner is optional.

Table 100. UFBGA129 mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

A(2)

0.60

0.024

0.11

0.004

0.13

0.005

0.32

0.013

b(3)

0.24

0.29

0.34

0.009

0.011

0.013

B09R_UFBGA129_ME_V2

EF G H

AB C D

JK L M

A1 corner index area

BOTTOM VIEW

b (129 balls)

eee

f f f M

ddd

SEATING

PLANE

STM32WB55 Datasheet(PDF) 170 Page - STMicroelectronics

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