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STM32WB55 Datasheet(PDF) 173 Page - STMicroelectronics |
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STM32WB55 Datasheet(HTML) 173 Page - STMicroelectronics |
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173 / 193 page ![]() DS11929 Rev 11 173/193 STM32WB55xx STM32WB35xx Package information 185 7.2 WLCSP100 package information WLCSP100 is a 100-ball, 4.390 x 4.371 mm, 0.4 mm pitch, wafer level chip scale package. Figure 41. WLCSP100 outline A K 10 1 F G e1 A1 BALL LOCATION e4 e2 E K H e3 e e D BOTTOM VIEW E D TOP VIEW A1 DETAIL A A A2 SIDE VIEW A3 FRONT VIEW A2 A1 BUMP SEATING PLANE DETAIL A ROTATED 90 A08S_WLCSP100_ME_V1 |
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