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MIC38C43 Datasheet(PDF) 6 Page - Microchip Technology |
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MIC38C43 Datasheet(HTML) 6 Page - Microchip Technology |
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6 / 24 page ![]() MIC38C42/43/44/45 DS20006436B-page 6 2020 - 2022 Microchip Technology Inc. and its subsidiaries TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Storage Temperature Range TS –65 — +150 °C — Operating Ambient Temperature Range TA –40 — +85 °C — Operating Junction Temperature Range TJ –40 — +125 °C — Maximum Junction Temperature TJ(MAX) — — +150 °C — Package Thermal Resistance Thermal Resistance 8-Ld Plastic DIP θJA — 125 — °C/W — Thermal Resistance 8-Ld MSOP θJA — 250 — °C/W — Thermal Resistance 8-Ld SOIC θJA — 170 — °C/W — Thermal Resistance 14-Ld Plastic DIP θJA — 90 — °C/W — Thermal Resistance 14-Ld SOIC θJA — 145 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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