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STB41N40DM6AG Datasheet(PDF) 3 Page - STMicroelectronics |
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STB41N40DM6AG Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 14 page ![]() 2 Electrical characteristics TC = 25 °C unless otherwise specified Table 4. On-/off-states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage VGS= 0 V, ID = 1 mA 400 V IDSS Zero gate voltage drain current VGS = 0 V, VDS = 400 V 1 µA VGS = 0 V, VDS = 400 V, TC = 125 °C(1) 100 µA IGSS Gate body leakage current VDS = 0 V, VGS = ±25 V ±1 µA VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 3 4 5 V RDS(on) Static drain-source on-resistance VGS = 10 V, ID = 20.5 A 0.050 0.065 Ω 1. Defined by design, not subject to production test. Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance VDS = 100 V, f = 1 MHz, VGS = 0 V - 2310 - pF Coss Output capacitance - 151 - pF Crss Reverse transfer capacitance - 10 - pF Coss eq.(1) Equivalent output capacitance VDS = 0 to 320 V, VGS = 0 V - 450 - pF RG Intrinsic gate resistance f = 1 MHz open drain - 1.3 - Ω Qg Total gate charge VDD = 320 V, ID = 41 A, VGS = 0 to 10 V (see Figure 14. Test circuit for gate charge behavior) - 53 - nC Qgs Gate-source charge - 12 - nC Qgd Gate-drain charge - 29 - nC 1. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS. Table 6. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time VDD = 200 V, ID = 20.5 A, RG = 4.7 Ω, VGS = 10 V (see Figure 13. Test circuit for resistive load switching times and Figure 18. Switching time waveform) - 18 - ns tr Rise time - 10.3 - ns td(off) Turn-off delay time - 46 - ns tf Fall time - 9.4 - ns STB41N40DM6AG Electrical characteristics DS12571 - Rev 1 page 3/14 |
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