SPC5643LFF2MLL6 datasheet(79/136 Pages) NXP

79 / 136 page

Electrical characteristics

MPC5643L Microcontroller Data Sheet, Rev. 10

NXP Semiconductors

Table 11. Thermal characteristics for 144 LQFP package1

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

Symbol

Parameter

Conditions

Value Unit

RθJA

Thermal resistance, junction-to-ambient natural

convection2

2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board – 1s

°C/W

Four layer board – 2s2p

RθJMA

Thermal resistance, junction-to-ambient forced

convection at 200 ft/min

Single layer board – 1s

°C/W

Four layer board – 2s2p

RθJB

Thermal resistance junction-to-board3

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

—24

°C/W

RθJC

Thermal resistance junction-to-case4

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

—8

°C/W

ΨJT

Junction-to-package-top natural convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

—2

°C/W

Table 12. Thermal characteristics for 257 MAPBGA package1

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

Symbol

Parameter

Conditions

Value Unit

RθJA

Thermal resistance junction-to-ambient natural

convection2

2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board – 1s

°C/W

Four layer board – 2s2p

RθJMA

Thermal resistance, junction-to-ambient forced

convection at 200 ft/min

Single layer board – 1s

°C/W

Four layer board – 2s2p

RθJB

Thermal resistance junction-to-board3

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

—13

°C/W

RθJC

Thermal resistance junction-to-case4

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

—8

°C/W

ΨJT

Junction-to-package-top natural convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

—2

°C/W

SPC5643LFF2MLL6 Datasheet(PDF) 79 Page - NXP Semiconductors

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