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PPC5605BAMLL4R Datasheet(PDF) 107 Page - NXP Semiconductors

Part # PPC5605BAMLL4R
Description  MPC5607B Microcontroller Data Sheet
PDF  114 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PPC5605BAMLL4R Datasheet(HTML) 107 Page - NXP Semiconductors

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Ordering information
MPC5607B Microcontroller Data Sheet, Rev. 10
NXP Semiconductors
107
6
Ordering information
Figure 40. Commercial product code structure
Note: Not all options are available on all devices.
1 208 MAPBGA is available only as development package for Nexus2+.
Appendix A Abbreviations
Table 53 lists abbreviations used but not defined elsewhere in this document.
Table 53. Abbreviations
Abbreviation
Meaning
CMOS
Complementary metal oxide semiconductor
CPHA
Clock phase
CPOL
Clock polarity
CS
Peripheral chip select
EVTO
Event out
MCKO
Message clock out
MDO
Message data out
MSEO
Message start/end out
MTFE
Modified timing format enable
SCK
Serial communications clock
SOUT
Serial data out
Qualification Status
Power Architecture Core
Automotive Platform
Core Version
Flash Size (core dependent)
Product
Temperature spec.
MPC
56
B
M
LL
6
Example code:
07
Package Code
Frequency
Qualification Status
M = general market qualified
S = Automotive qualified
P = Engineering samples
Automotive Platform
56 = PPC in 90nm
Core Version
0 = e200z0
Flash Size (for z0 core)
5 = 768 KB
6 = 1024 KB
7 = 1.5 MB
Product
B = Body
Fab and Mask Indicator
F = ATMC Fab
K = TSMC Fab
A = ATMC Fab or TSMC Fab
Second digit usually differentiate mask rev
R = Tape & Reel (blank if Tray)
R
Temperature spec.
C = -40 to 85 °C
V = -40 to 105 °C
M = -40 to 125 °C
Package Code
LL = 100 LQFP
LQ = 144 LQFP
LU = 176 LQFP
MG = 208 MAPBGA1
Frequency
4 = Up to 48 MHz
6 = Up to 64 MHz
Fab and Mask Indicator
F1



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